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>Products >Applications for Application for INTEL™ P4 LGA775
TR2 M13 (LGA775)
Features
Application for
INTEL™ LGA775 Prescott FMB2
Heatsink: Copper base inserted, excellent heat
dissipation
High performing fan, increase airflow by intake air from multi-directional
Silent solution, 21dBA only
Push pin design, require no tool to install
Interface material : Dow Corning SC102


Key Points
High performing fan, increase airflow by intake air from multi-directional Radial Fin
   
Copper Base    

Dimension Thermal Performance

Detail Spec.
PN
A4013
Fan Speed
2500 ±10% RPM
Fan Dimension
90x90x25 mm
Max. Air Flow
52.24 CFM
Heatsink Dimension
Ø90x40 mm
Max. Air Pressure
2.84 mm H2O
Rated Voltage
12V
Noise
21 dBA
Started Voltage
5V
 Bearing Type
Ball Bearing
Rated Current
0.18 A
Life Expectation
50,000 Hours
Power Input
2.16 W
Connector
3Pin
TIM
Dow Corning SC102
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